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Condition: New Location: , United States
The kit contains 33Pcs BGA Heated Directly Reballing Stencils + BGA Lead Solder Balls (0.30mm, 0.35mm, 0.40mm, 0.45mm, 0.50mm, 0.55mm, 0.60mm, 0.76mm). A Tool Kit for BGA Soldering Repair. Quantity 33Pcs.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencils. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. Suitable for iPhone 11 12 13 iOS LCD Screen Repair. • High temperature resistance, no bulging, no deformation.
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Condition: New Location: , United States
The kit contains 36Pcs BGA Heated Directly Reballing Stencils + BGA Lead Solder Balls (0.30mm, 0.35mm, 0.40mm, 0.45mm, 0.50mm, 0.55mm, 0.60mm, 0.76mm). A Tool Kit for BGA Soldering Repair. These stencils can be heated directly by a hot air blower with solder balls to make the reballing process run smoother.
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Condition: New Location: , United States
Quantity 47Pcs. XBOX360 KSB X850744-004. These stencils can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencils. XBOX360 CPU. XBOX360 CSP.
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Condition: New Location: , United States
27Pcs BGA 80x80MM Universal Reballing Stencils for Laptop Chip Repair. These non-heated stencils should be worked with 80x80MM BGA reballing station/jig. Quantity 27Pcs. Universal Stencil. Universal Stencil L002 (P=0.5mm).
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Condition: New Location: , HK
27Pcs BGA Heated Directly Universal Reballing Stencils for Laptop Chip Repair. Quantity 27Pcs. These stencils can be heated directly by a hot air blower to make the reballing process run smoother. Universal stencil (pitch=0.5mm).
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Condition: New Location: , United States
Quantity 47Pcs. XBOX360 KSB X850744-004. These stencils can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencils. XBOX360 CPU. XBOX360 CSP.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for Samsung Note4 Series Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencils. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. Suitable for iPhone Series IC Chip Repair. • High temperature resistance, no bulging, no deformation.
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Condition: New Location: , United States
The kit contains 16Pcs BGA Heated Directly Universal Reballing Stencils + BGA Lead Solder Balls (0.30mm, 0.35mm, 0.40mm, 0.45mm, 0.50mm, 0.55mm, 0.60mm, 0.76mm). These stencils can be heated directly by a hot air blower with solder balls to make the reballing process run smoother.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for iPhone Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: 福田区, China
10 pcs 90X90mm BGA reball stencil! These are for These are for90mmX90mm BGA reballing station We also have IC chip and other reballing products for sale. We are always willing to work things out.
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Condition: New Location: , United States
36Pcs BGA Heated Directly Reballing Stencils for Laptop/GPU/CPU Chip Repair. These stencils can be heated directly by a hot air blower to make the reballing process run smoother. Quantity 36Pcs. BGA Heated Directly Reballing Stencils.
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Condition: New Location: , United States
The kit contains 10Pcs BGA 80x80MM Universal Reballing Stencils + BGA Lead Solder Balls (0.30mm, 0.35mm, 0.40mm, 0.45mm, 0.50mm, 0.55mm, 0.60mm, 0.76mm). These non-heated stencils should be worked with 80x80mm BGA reballing station/jig.
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Condition: New Location: , HK
The kit contains 27Pcs BGA 80x80MM Universal Reballing Stencils + 11 Bottles of 25K BGA Lead Solder Balls (0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm, 0.5mm, 0.55mm, 0.6mm, 0.65mm, 0.76mm). These non-heated stencils should be worked with 80x80mm BGA reballing station/jig.
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Condition: New Location: , United States
The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencils. Suitable for iPhone 11 12 13 iOS LCD Screen Repair. • High temperature resistance, no bulging, no deformation.
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Condition: New Location: , United States
33Pcs BGA Heated Directly Reballing Stencils for Laptop/GPU/CPU Chip Repair. These stencils can be heated directly by a hot air blower to make the reballing process run smoother. Quantity 33Pcs. BGA Heated Directly Reballing Stencils.
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Condition: New Location: 福田区, China
90mmX90mm 0.25mm BGA reball universal stencil(pitch=0.5mm) 1;. This is for 90mmX90mm BGA reballing station 1 piece 90X90mm 0.25mm universal stencil(pitch=0.5mm) ! We also IC chip and other reballing products for sale.Andwe can make the stencil what you want for you also.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for iPhone Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
Feature: 1. FOUR PITCHES: Universal BGA reballing stencil has three types of holes with 0.3 0.35 0.4 0.5 pitch, four kinds of spacing and multiple sizes. COMPACT APPEARANCE: Universal BGA reballing stencil has a compact appearance and is easy to carry around and use.
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Condition: New Location: , HK
BGA Heated Directly Reballing Stencil + Lead Solder Paste (50G/Bottle) for iPhone IC Chip Repair. The stencil can be heated directly by a hot air blower with the solder paste to make the reballing process run smoother.
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Condition: New Location: , United States
16Pcs BGA Heated Directly Universal Reballing Stencils for Laptop Chip Repair. These stencils can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Universal Reballing Stencils.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for iPhone Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
Feature: 1. FOUR PITCHES: Universal BGA reballing stencil has three types of holes with 0.3 0.35 0.4 0.5 pitch, four kinds of spacing and multiple sizes. COMPACT APPEARANCE: Universal BGA reballing stencil has a compact appearance and is easy to carry around and use.
0 bids $4.88 Shipping
Condition: New Location: 福田区, China
Type A for the stencil holder(80 80mm) We also IC chip and other reballing products for sale.Andwe can make the stencil what you want for you also. We have the IC chip for sale also. We are always willing to work things out.
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Condition: New Location: , HK
BGA Heated Directly Reballing Stencil for iPhone Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
0 bids Free Shipping
Condition: New Location: , United States
Feature: 1. FOUR PITCHES: Universal BGA reballing stencil has three types of holes with 0.3 0.35 0.4 0.5 pitch, four kinds of spacing and multiple sizes. COMPACT APPEARANCE: Universal BGA reballing stencil has a compact appearance and is easy to carry around and use.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for Samsung Note4 Series Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
27Pcs BGA 80x80MM Universal Reballing Stencils for Laptop Chip Repair. These non-heated stencils should be worked with 80x80MM BGA reballing station/jig. Quantity 27Pcs. Universal Stencil. Universal Stencil L002 (P=0.5mm).
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Condition: New Location: , HK
The kit contains 21Pcs BGA Heated Directly Reballing Stencils + BGA Lead Solder Balls (0.30mm, 0.35mm, 0.40mm, 0.45mm, 0.50mm, 0.55mm, 0.60mm, 0.76mm). Quantity 21Pcs. These stencils can be heated directly by a hot air blower with solder balls to make the reballing process run smoother.
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Condition: New Location: , United States
These stencils can be heated directly by a hot air blower to make the reballing process run smoother. Quantity 14Pcs. BGA Heated Directly Reballing Stencils. For 0.45mm solder ball (13Pcs) For 0.40mm solder ball (1Pc).
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Condition: New Location: , HK
The kit contains 10Pcs BGA 80x80MM Universal Reballing Stencils + BGA Lead Solder Balls (0.30mm, 0.35mm, 0.40mm, 0.45mm, 0.50mm, 0.55mm, 0.60mm, 0.76mm). These non-heated stencils should be worked with 80x80mm BGA reballing station/jig.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for Samsung J720/A305/G8870/G887/A40S/A8S Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for IPad Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil. • Suitable for iPad 6, Mini 4.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for Samsung A9/C9 Series Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for Samsung A7/A5/A3/S5/J7 Series Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
• Suitable for iIPad 5, Mini 2/3. BGA Heated Directly Reballing Stencil for IPad Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
10Pcs BGA Heated Directly Universal Reballing Stencils for Laptop Chip Repair. These stencils can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Universal Reballing Stencils.
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Condition: New Location: , HK
The kit contains 27Pcs BGA Heated Directly Universal Reballing Stencils + 11 Bottles of 25K BGA Lead Solder Balls (0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm, 0.5mm, 0.55mm, 0.6mm, 0.65mm, 0.76mm). A Tool Kit for BGA Soldering Repair.
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Condition: New Location: , HK
The kit contains 27Pcs BGA 90x90MM Universal Reballing Stencils + 11 Bottles of 25K BGA Lead Solder Balls (0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm, 0.5mm, 0.55mm, 0.6mm, 0.65mm, 0.76mm). These non-heated stencils should be worked with 90x90mm BGA reballing station/jig.
Buy It Now
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for iPhone Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for Samsung S9/S9+Series Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for Samsung S8/S8+/Note8 Series Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for Samsung J720/A305/G8870/G887/A40S/A8S Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for Samsung J720/A305/G8870/G887/A40S/A8S Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for Samsung Note4 Series Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for IPad Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil. • Can be heated by the hot air machine.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for Samsung Note4 Series Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for iPhone Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for iPhone Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
Buy It Now
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for Samsung J720/A305/G8870/G887/A40S/A8S Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
10Pcs BGA Heated Directly Universal Reballing Stencils for Laptop Chip Repair. These stencils can be heated directly by a hot air blower to make the reballing process run smoother. Quantity 10Pcs. Universal stencil (pitch=0.58mm).
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for IPad Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil. • Suitable for Hard disk of iPhone series.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for iPhone Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , HK
BGA Heated Directly Reballing Stencil for iPhone Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for iPhone Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for IPad Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil. • Suitable for iPad 6, Mini 4.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for Samsung Note4 Series Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , HK
BGA Heated Directly Reballing Stencils. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. • Can be heated by the hot air machine. Suitable for iPhone 11 12 13 iOS LCD Screen Repair.
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Condition: New Location: , United States
27Pcs BGA 90x90MM Universal Reballing Stencils for Laptop Chip Repair. These non-heated stencils should be worked with 90x90MM BGA reballing station/jig. BGA 90x90MM Universal Reballing Stencils. Quantity 27Pcs.
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