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Condition: New Location: , United States
BGA Heated Directly Reballing Stencils. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. Suitable for iPhone Series IC Chip Repair. • High temperature resistance, no bulging, no deformation.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencils. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. Suitable for iPhone 11 12 13 iOS LCD Screen Repair. • High temperature resistance, no bulging, no deformation.
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Condition: New Location: , HK
BGA Heated Directly Reballing Stencil + Lead Solder Paste (50G/Bottle) for Samsung S9/S9+Series IC Chip Repair. The stencil can be heated directly by a hot air blower with the solder paste to make the reballing process run smoother.
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Condition: New Location: , HK
The kit contains 47Pcs BGA Heated Directly Reballing Stencils + BGA Lead Solder Balls (0.30mm, 0.35mm, 0.40mm, 0.45mm, 0.50mm, 0.55mm, 0.60mm, 0.76mm). Quantity 47Pcs. A Tool Kit for BGA Soldering Repair.
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Condition: New Location: 福田区, China
90mmX90mm 0.25mm BGA reball universal stencil(pitch=0.5mm) 1;. This is for 90mmX90mm BGA reballing station 1 piece 90X90mm 0.25mm universal stencil(pitch=0.5mm) ! We also IC chip and other reballing products for sale.Andwe can make the stencil what you want for you also.
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Condition: New Location: , HK
BGA Heated Directly Reballing Stencils. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. • High temperature resistance, no bulging, no deformation. • Can be heated by the hot air machine.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for iPhone Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , HK
BGA Heated Directly Reballing Stencil for iPhone Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
33Pcs BGA Heated Directly Reballing Stencils for Laptop/GPU/CPU Chip Repair. These stencils can be heated directly by a hot air blower to make the reballing process run smoother. Quantity 33Pcs. BGA Heated Directly Reballing Stencils.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for IPad Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil. • Suitable for iPad 6, Mini 4.
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Condition: New Location: , United States
Feature: 1. FOUR PITCHES: Universal BGA reballing stencil has three types of holes with 0.3 0.35 0.4 0.5 pitch, four kinds of spacing and multiple sizes. COMPACT APPEARANCE: Universal BGA reballing stencil has a compact appearance and is easy to carry around and use.
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Condition: New Location: 福田区, China
You can buy the reball station for this stencil at. you can buy the stencil sets at. We are always willing to work things out. If we know about it, we can fix it. Italy and other countries.
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Condition: New Location: , HK
The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencils. • Added chip IC identification code. • High temperature resistance, no bulging, no deformation.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for Samsung S8/S8+/Note8 Series Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , HK
BGA Heated Directly Reballing Stencil for IPad Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil. • Can be heated by the hot air machine.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencils. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. • High temperature resistance, no bulging, no deformation. • Can be heated by the hot air machine.
0 bids $4.88 Shipping
Condition: New Location: 福田区, China
You can buy the reball station for this stencil at. you can buy the stencil sets at. We are always willing to work things out. If we know about it, we can fix it. Italy and other countries. USA, Canada, Australia.
0 bids Free Shipping
Condition: New Location: , United States
Feature: 1. FOUR PITCHES: Universal BGA reballing stencil has three types of holes with 0.3 0.35 0.4 0.5 pitch, four kinds of spacing and multiple sizes. COMPACT APPEARANCE: Universal BGA reballing stencil has a compact appearance and is easy to carry around and use.
0 bids $4.88 Shipping
Condition: New Location: 福田区, China
80mmX80mm 0.25mm BGA reball universal stencil(pitch=0.5mm) 1;. 1 piece 80X80mm 0.25mm universal stencil(pitch=0.5mm) ! This is for Type A for the stencil holder(80 80mm) We also IC chip and other reballing products for sale.Andwe can make the stencil what you want for you also.
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Condition: New Location: , HK
BGA Heated Directly Reballing Stencil for iPhone Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: 福田区, China
Type A for the stencil holder(80 80mm) We also IC chip and other reballing products for sale.Andwe can make the stencil what you want for you also. We have the IC chip for sale also. We are always willing to work things out.
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Condition: New Location: , HK
The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly 3D Groove Solder Paste Printing Steel Stencil for IPhone/IPad Chip Repair. BGA Heated Directly 3D Groove Solder Paste Printing Steel Stencil.
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Condition: New Location: , United States
16Pcs BGA Heated Directly Universal Reballing Stencils for Laptop Chip Repair. These stencils can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Universal Reballing Stencils.
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Condition: New Location: , HK
33Pcs BGA Heated Directly Reballing Stencils for Laptop/GPU/CPU Chip Repair. Quantity 33Pcs. These stencils can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencils.
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Condition: New Location: , United States
Feature: 1. FOUR PITCHES: Universal BGA reballing stencil has three types of holes with 0.3 0.35 0.4 0.5 pitch, four kinds of spacing and multiple sizes. COMPACT APPEARANCE: Universal BGA reballing stencil has a compact appearance and is easy to carry around and use.
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Condition: New Location: 福田区, China
1 piece 80X80mm BGA reball Stencil for NH82801BA FW82801BA 82801BA(use 0.6 balls)! This is for Type A for the stencil holder(80 80mm) We also IC chip and other reballing products for sale.Andwe can make the stencil what you want for you also.
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Condition: New Location: 福田区, China
A10 A20 HI3507RBC100 HI3507RBCV100 TFBGA441 CPU BGA reball heated stencil 1 (use 0.4mm solder balls). you can buy the reball station for this stencil at. you can buy the stencil sets at. We are always willing to work things out.
0 bids $4.88 Shipping
Condition: New Location: 福田区, China
You can buy the reball station for this stencil at. you can buy the stencil sets at. We are always willing to work things out. If we know about it, we can fix it. Italy and other countries. USA, Canada, Australia.
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Condition: New Location: , HK
BGA Heated Directly Reballing Stencil for IPad Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil. • Suitable for Hard disk of iPhone series.
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Condition: New Location: , HK
27Pcs BGA 90x90MM Universal Reballing Stencils for Laptop Chip Repair. These non-heated stencils should be worked with 90x90MM BGA reballing station/jig. BGA 90x90MM Universal Reballing Stencils. Quantity 27Pcs.
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Condition: New Location: , HK
BGA Heated Directly Reballing Stencil + Lead-free Solder Paste (50G/Bottle) for IPad IC Chip Repair. The stencil can be heated directly by a hot air blower with the solder paste to make the reballing process run smoother.
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Condition: New Location: , United States
The kit contains 33Pcs BGA Heated Directly Reballing Stencils + BGA Lead Solder Balls (0.30mm, 0.35mm, 0.40mm, 0.45mm, 0.50mm, 0.55mm, 0.60mm, 0.76mm). A Tool Kit for BGA Soldering Repair. Quantity 33Pcs.
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Condition: New Location: , United States
10Pcs BGA Heated Directly Universal Reballing Stencils for Laptop Chip Repair. These stencils can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Universal Reballing Stencils.
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Condition: New Location: , HK
BGA Heated Directly Reballing Stencil for Samsung S8/S8+/Note8 Series Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , HK
BGA Heated Directly Reballing Stencil for Samsung S6/S6+/Note5 Series Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , HK
BGA Heated Directly Reballing Stencil for Samsung A7/A5/A3/S5/J7 Series Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for Samsung Note4 Series Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , HK
• Suitable for iIPad 5, Mini 2/3. BGA Heated Directly Reballing Stencil for IPad Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencils. Suitable for iPhone 11 12 13 iOS LCD Screen Repair. • High temperature resistance, no bulging, no deformation.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencils. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. • Added chip IC identification code. • High temperature resistance, no bulging, no deformation.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for iPhone Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , HK
BGA Heated Directly Reballing Stencil for iPhone Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for iPhone Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for iPhone Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for Samsung A9/C9 Series Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for Samsung Note4 Series Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for iPhone Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , HK
BGA Heated Directly Reballing Stencil for Samsung J720/A305/G8870/G887/A40S/A8S Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for Samsung J1/J2/J3/J4 Series Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for iPhone Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
• Suitable for iIPad 5, Mini 2/3. BGA Heated Directly Reballing Stencil for IPad Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for Samsung Note4 Series Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for Samsung A7/A5/A3/S5/J7 Series Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for iPhone Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for Samsung J1/J2/J3/J4 Series Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for IPad Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil. • Can be heated by the hot air machine.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for IPad Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil. • Suitable for iPad 6, Mini 4.
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Condition: New Location: , HK
BGA Heated Directly Reballing Stencil for iPhone Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , HK
The kit contains 27Pcs BGA Heated Directly Universal Reballing Stencils + 11 Bottles of 25K BGA Lead Solder Balls (0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm, 0.5mm, 0.55mm, 0.6mm, 0.65mm, 0.76mm). A Tool Kit for BGA Soldering Repair.
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Condition: New Location: , United States
The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly 3D Groove Solder Paste Printing Steel Stencil for IPhone/IPad Chip Repair. BGA Heated Directly 3D Groove Solder Paste Printing Steel Stencil.
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