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Condition: New Location: , United States
10Pcs BGA Heated Directly Universal Reballing Stencils for Laptop Chip Repair. These stencils can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Universal Reballing Stencils.
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Condition: New Location: , United States
• Suitable for iIPad 5, Mini 2/3. BGA Heated Directly Reballing Stencil for IPad Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for IPad Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil. • Suitable for iPad 6, Mini 4.
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BGA Heated Directly Reballing Stencil for Samsung J720/A305/G8870/G887/A40S/A8S Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for iPhone Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
10Pcs BGA Heated Directly Universal Reballing Stencils for Laptop Chip Repair. These stencils can be heated directly by a hot air blower to make the reballing process run smoother. Quantity 10Pcs. Universal stencil (pitch=0.58mm).
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Condition: New Location: , HK
BGA Heated Directly Reballing Stencil for iPhone Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , HK
BGA Heated Directly Reballing Stencil for Samsung Note4 Series Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
33Pcs BGA Heated Directly Reballing Stencils for Laptop/GPU/CPU Chip Repair. These stencils can be heated directly by a hot air blower to make the reballing process run smoother. Quantity 33Pcs. BGA Heated Directly Reballing Stencils.
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Condition: New Location: , United States
10Pcs BGA 90x90MM Universal Reballing Stencils for Laptop Chip Repair. These non-heated stencils should be worked with 90x90MM BGA reballing station/jig. Quantity 10Pcs. Universal Stencil B001 (P=0.58mm).
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Condition: New Location: , HK
Quantity 47Pcs. These stencils can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencils. For 0.3mm solder ball (11Pcs) For 0.35mm solder ball (3Pcs).
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Condition: New Location: , United States
The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly 3D Groove Solder Paste Printing Steel Stencil for IPhone/IPad Chip Repair. BGA Heated Directly 3D Groove Solder Paste Printing Steel Stencil.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for iPhone Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , HK
The kit contains 10Pcs BGA 90x90MM Universal Reballing Stencils + BGA Lead Solder Balls (0.30mm, 0.35mm, 0.40mm, 0.45mm, 0.50mm, 0.55mm, 0.60mm, 0.76mm). These non-heated stencils should be worked with 90x90mm BGA reballing station/jig.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencils. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. • Added chip IC identification code. • High temperature resistance, no bulging, no deformation.
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Condition: New Location: , HK
27Pcs BGA 80x80MM Universal Reballing Stencils for Laptop Chip Repair. These non-heated stencils should be worked with 80x80MM BGA reballing station/jig. BGA 80x80MM Universal Reballing Stencils. Quantity 27Pcs.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for IPad Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil. • Suitable for iPad 6, Mini 4.
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Condition: New Location: , HK
BGA Heated Directly Reballing Stencil for IPad Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil. • Can be heated by the hot air machine.
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Condition: New Location: , HK
BGA Heated Directly Reballing Stencil + Lead Solder Paste (50G/Bottle) for Samsung S8/S8+/Note8 Series IC Chip Repair. The stencil can be heated directly by a hot air blower with the solder paste to make the reballing process run smoother.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for Samsung S6/S6+/Note5 Series Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , HK
BGA Heated Directly Reballing Stencil for iPhone Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for iPhone Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for iPhone Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for iPhone Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
Quantity 21Pcs. These stencils can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencils. XBOX360 KSB X850744-004. XBOX360 CPU. XBOX360 CSP.
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Condition: New Location: , United States
16Pcs BGA Heated Directly Universal Reballing Stencils for Laptop Chip Repair. These stencils can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Universal Reballing Stencils.
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Condition: New Location: , United States
10Pcs BGA 80x80MM Universal Reballing Stencils for Laptop Chip Repair. These non-heated stencils should be worked with 80x80MM BGA reballing station/jig. BGA 80x80MM Universal Reballing Stencils. Quantity 10Pcs.
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Condition: New Location: , United States
Feature: 1. FOUR PITCHES: Universal BGA reballing stencil has three types of holes with 0.3 0.35 0.4 0.5 pitch, four kinds of spacing and multiple sizes. COMPACT APPEARANCE: Universal BGA reballing stencil has a compact appearance and is easy to carry around and use.
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Condition: New Location: , HK
The kit contains 47Pcs BGA Heated Directly Reballing Stencils + BGA Lead Solder Balls (0.30mm, 0.35mm, 0.40mm, 0.45mm, 0.50mm, 0.55mm, 0.60mm, 0.76mm). Quantity 47Pcs. A Tool Kit for BGA Soldering Repair.
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BGA Heated Directly Reballing Stencil for Samsung A9/C9 Series Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for Samsung S8/S8+/Note8 Series Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
27Pcs BGA 90x90MM Universal Reballing Stencils for Laptop Chip Repair. These non-heated stencils should be worked with 90x90MM BGA reballing station/jig. BGA 90x90MM Universal Reballing Stencils. Quantity 27Pcs.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for Samsung S8/S8+/Note8 Series Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: 福田区, China
Type A for the stencil holder(80 80mm) We also IC chip and other reballing products for sale.Andwe can make the stencil what you want for you also. We have the IC chip for sale also. We are always willing to work things out.
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Condition: New Location: , HK
BGA Heated Directly Reballing Stencil for IPad Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil. • Suitable for iPad 6, Mini 4.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencils. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. • Can be heated by the hot air machine. Suitable for iPhone 11 12 13 iOS LCD Screen Repair.
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Condition: New Location: 福田区, China
BD82QS67 E78296 SLJ4K BD82QS77 SLJ8B QPRF QP8D BGA reball heated stencil 1(use 0.35mm solder balls). you can buy the reball station for this stencil at. you can buy the stencil sets at. We are always willing to work things out.
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Condition: New Location: , United States
• Suitable for iIPad 5, Mini 2/3. BGA Heated Directly Reballing Stencil for IPad Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , HK
BGA Heated Directly Reballing Stencil + Lead Solder Paste (50G/Bottle) for IPad IC Chip Repair. The stencil can be heated directly by a hot air blower with the solder paste to make the reballing process run smoother.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencils. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. Suitable for iPhone Series IC Chip Repair. • High temperature resistance, no bulging, no deformation.
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Condition: New Location: 福田区, China
Socket AM2 940pins CPU BGA reball heated stencil 1(use 0.76mm solder balls). you can buy the reball station for this stencil at. you can buy the stencil sets at. We are always willing to work things out.
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Condition: New Location: , HK
The stencil can be heated directly by a hot air blower with the solder paste to make the reballing process run smoother. BGA Heated Directly 3D Groove Solder Paste Printing Steel Stencil + Lead Solder Paste (50G/Bottle) for IPhone/IPad IC Chip Repair.
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Condition: New Location: , HK
27Pcs BGA 90x90MM Universal Reballing Stencils for Laptop Chip Repair. These non-heated stencils should be worked with 90x90MM BGA reballing station/jig. BGA 90x90MM Universal Reballing Stencils. Quantity 27Pcs.
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Condition: New Location: , United States
Feature: 1. FOUR PITCHES: Universal BGA reballing stencil has three types of holes with 0.3 0.35 0.4 0.5 pitch, four kinds of spacing and multiple sizes. COMPACT APPEARANCE: Universal BGA reballing stencil has a compact appearance and is easy to carry around and use.
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Condition: New Location: , United States
Quantity 47Pcs. These stencils can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencils. For 0.3mm solder ball (11Pcs) For 0.35mm solder ball (3Pcs).
0 bids $4.88 Shipping
Condition: New Location: 福田区, China
AMD socket 941 CPU BGA reball heated stencil 1(use 0.76mm solder balls). you can buy the reball station for this stencil at. you can buy the stencil sets at. We are always willing to work things out.
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Condition: New Location: , HK
36Pcs BGA Heated Directly Reballing Stencils for Laptop/GPU/CPU Chip Repair. These stencils can be heated directly by a hot air blower to make the reballing process run smoother. Quantity 36Pcs. BGA Heated Directly Reballing Stencils.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencils. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. • High temperature resistance, no bulging, no deformation. • Can be heated by the hot air machine.
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Condition: New Location: , HK
BGA Heated Directly Reballing Stencil for iPhone Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
33Pcs BGA Heated Directly Reballing Stencils for Laptop/GPU/CPU Chip Repair. These stencils can be heated directly by a hot air blower to make the reballing process run smoother. Quantity 33Pcs. BGA Heated Directly Reballing Stencils.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for Samsung A7/A5/A3/S5/J7 Series Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for Samsung S9/S9+Series Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for Samsung J720/A305/G8870/G887/A40S/A8S Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for IPad Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil. • Can be heated by the hot air machine.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for Samsung Note4 Series Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for iPhone Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for Samsung Note4 Series Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for iPhone Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for IPad Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil. • Suitable for iPad 6, Mini 4.
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Condition: New Location: , United States
BGA Heated Directly Reballing Stencil for IPad Chip Repair. The stencil can be heated directly by a hot air blower to make the reballing process run smoother. BGA Heated Directly Reballing Stencil. • Can be heated by the hot air machine.
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